协同界面改性策略增强高模量碳纤维/聚醚醚酮复合材料的界面结合

Synergistic Interface Modification Strategy to Enhance Interfacial Bonding of High-Modulus Carbon Fiber/PEEK Composites

  • 摘要: 高模量碳纤维增强聚醚醚酮(HMCF/PEEK)复合材料在理论上具有极其优异的性能,但受限于HMCF与PEEK的高度不相容性,HMCF和PEEK在界面处的结合效果极差,严重影响了HMCF/PEEK的性能。有必要对HMCF进行合理的表面改性,改善复合材料界面结合效果。本文制备了具有良好热稳定性的聚乙烯亚胺/MXene(PMX)和磺化PEEK(SPEEK),分别通过阴极电泳沉积和上浆法对HMCF进行表面处理。结果表明PMX在HMCF表面排列均匀紧密,PMX-HMCF/PEEK复合材料的ILSS最高可以达到57.98 MPa。SPEEK对复合材料界面的增强作用强于PMX,S-HMCF/PEEK的ILSS达到了63.48MPa。PMX与SPEEK联合处理的S-PMX-HMCF/PEEK具有最优异的界面结合效果(ILSS达到了75.34 MPa,较脱浆HMCF/PEEK提升了133.52%),充分实现了SPEEK的桥接作用。PMX与SPEEK共同为HMCF提供了更高的表面能,在界面处形成了模量梯度变化,显著改善了界面结合效果。

     

    Abstract: High-modulus carbon fiber reinforced polyetheretherketone (HMCF/PEEK) composites theoretically exhibit extremely excellent properties. However, limited by the high incompatibility between HMCF and PEEK, the bonding effect at the interface between HMCF and PEEK is extremely poor, which seriously affects the performance of HMCF/PEEK composites. Therefore, it is necessary to carry out reasonable surface modification on HMCF to improve the bonding effect at HMCF/PEEK interface. In this paper, PEI/MXene (PMX) and sulfonated PEEK (SPEEK) were prepared. The surface of HMCF was treated by cathodic electrophoretic deposition and sizing method, respectively. The results show that PMX is uniformly and closely arranged on the surface of HMCF. The interlaminar shear strength (ILSS) of PMX-HMCF/PEEK composites can reach up to 57.98 MPa. Notably, SPEEK demonstrates a more potent reinforcing effect on the composite interface than PMX. The ILSS of the S-HMCF/PEEK composite reaches 63.48 MPa. S-PMX-HMCF/PEEK modified by the joint treatment of PMX and SPEEK exhibits the optimal interfacial bonding effect (ILSS reached 75.34 MPa, representing a 133.52% increase over D-HMCF/PEEK), with the expected bridging effect of SPEEK at the interface fully realized. PMX and SPEEK jointly provide higher surface energy for HMCF, form a modulus gradient change at the interface, significantly improve the interfacial bonding effect.

     

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