Abstract: The scale of integrated circuits is constantly increasing and their size is getting smaller, and heat dissipation has become a key issue for the further development of high-density integrated circuits. Diamond/copper composite material has the characteristics of high thermal conductivity and thermal stability, which is expected to solve the heat dissipation problem of devices under high heat flux density, and has aroused widespread research interest. This paper focuses on the new generation of high thermal conductivity diamond/copper composites for high density integrated circuit heat dissipation, and reviews the research progress of its main preparation methods and high thermal conductivity optimization processes. The bottleneck problem of improving its thermal conductivity is further analyzed. Finally, its development direction and application advantages are prospected, which will provide guidance and reference for the preparation and application of diamond/copper composites and related high thermal conductivity materials.